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Nanoparticle effect of heat conduction mechanism during solidification of PCM
Journal article   Open access  Peer reviewed

Nanoparticle effect of heat conduction mechanism during solidification of PCM

Zhihong Dai, Alibek Issakhov and Mahmoud Mohamed Selim
Applied nanoscience
03/08/2021

Abstract

Nanoscience & Nanotechnology Science & Technology Science & Technology - Other Topics
url
https://doi.org/10.1007/s13204-021-01999-xView
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