Abstract
Structure, hardness, mechanical and electrical transport properties of the rapidly solidified Pb-25Sn alloy with Cd additions have been investigated. The results show that, a continuous increase in Cd content causes more precipitations of Cd as a third phase, which in turn causes continuous enhancement of the wetting, electrical and mechanical properties of this alloy. In spite of the higher value of TCR for the alloy Pb-25Sn-20Cd, it has the most enhanced properties when compared with the others. It has a lower electrical resistivity, lower wetting angle, higher Vickers microhardness values and yield strength when compared with the eutectic Pb-Sn solder alloy.