Numerical Study of Gold Wire Bonding Process on Cu/Low-k Structures

A.G.K Viswanath; Xiaowu Zhang Xiaowu Zhang; V.P Ganesh; Lu Chun Lu Chun; Chun LU

doi:10.1109/TADVP.2006.890213

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Journal article

Numerical Study of Gold Wire Bonding Process on Cu/Low-k Structures

A.G.K Viswanath, Xiaowu Zhang Xiaowu Zhang, V.P Ganesh, Lu Chun Lu Chun and Chun LU

IEEE transactions on advanced packaging, Vol.30(3), pp.448-456

01/08/2007

DOI: https://doi.org/10.1109/TADVP.2006.890213

Abstract

Studies

The FE framework allowed for the detailed study of stress evolution in the Cu/low-k structure during the process in order to elucidate the evolved stresses due to the deformation behavior of the bond pad.

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Title: Numerical Study of Gold Wire Bonding Process on Cu/Low-k Structures
Creators - without role: A.G.K Viswanath - Institute of High Performance Computing
Xiaowu Zhang Xiaowu Zhang
V.P Ganesh - Institute of Microelectronics
Lu Chun Lu Chun
Chun LU - King Abdullah University of Science & Technology
Publication Details: IEEE transactions on advanced packaging, Vol.30(3), pp.448-456
Publisher: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Identifiers: 9943809708331
Academic Unit: King Abdullah University of Science & Technology
Language: English
Resource Type: Journal article