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On the impact of process variations for carbon nanotube bundles for VLSI interconnect
Journal article   Peer reviewed

On the impact of process variations for carbon nanotube bundles for VLSI interconnect

Arthur Nieuwoudt and Yehia Massoud
IEEE transactions on electron devices, Vol.54(3), pp.446-455
01/03/2007

Abstract

Applied sciences Design. Technologies. Operation analysis. Testing Electric, optical and optoelectronic circuits Electronics Exact sciences and technology Integrated circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Theoretical study. Circuits analysis and design

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