Abstract
Recent developments in organic transistor semiconductors and engineering have led to a situation where the performance of state-of-the-art organic transistors (organic field-effect transistors) often is limited by the resistance at the metal/semiconductor contacts, rather than the semiconductor channel. This letter shows that organic transistor contacts can be improved by the most important industrial process for the deposition of noble metals, electroplating. The advantages of electroplating over vacuum-based techniques such as evaporating and sputtering, in particular for the deposition of platinum (Pt), are discussed.