Particle contamination of silicon in SF6 and CF4/O2 RF etch plasmas

Journal article

Peer reviewed

M. M Smadi, G. Y Kong, R. N Carlile and S. E Beck

Journal of the Electrochemical Society, Vol.139(11), pp.3356-3363

01/11/1992

Abstract

Condensed matter: structure, mechanical and thermal properties

Exact sciences and technology

Mechanical and acoustical properties; adhesion

Physics

Solid surfaces and solid-solid interfaces

Solid-fluid interfaces

Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)

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Title: Particle contamination of silicon in SF6 and CF4/O2 RF etch plasmas
Creators - without role: M. M Smadi - University of Arizona
G. Y Kong - University of Arizona
R. N Carlile - University of Arizona
S. E Beck - University of Arizona
Publication Details: Journal of the Electrochemical Society, Vol.139(11), pp.3356-3363
Publisher: Electrochemical Society
Identifiers: 9932206708331
Academic Unit: University Ha'il
Language: English
Resource Type: Journal article