Progress on microstructure features and creep properties of prospective Tin-Silver-Zinc alloy using a magnetic field

Journal article

Open access

Peer reviewed

A E Hammad, Sara El-Molla, A F Abd El-Rehim and M Ragab

Materials Research Express, Vol.8(8), p.86506

01/08/2021

Abstract

creep properties

magnetic field

microstructure

Sn–Ag–Zn

solder alloy

url

https://doi.org/10.1088/2053-1591/ac1c35View

Published (Version of record) Open

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Title: Progress on microstructure features and creep properties of prospective Tin-Silver-Zinc alloy using a magnetic field
Creators - without role: A E Hammad - Zagazig University
Sara El-Molla - Zagazig University
A F Abd El-Rehim - King Khalid University
M Ragab - Higher Technological Institute
Publication Details: Materials Research Express, Vol.8(8), p.86506
Publisher: IOP Publishing
Number of pages: 12
Grant note: King Khalid University (https://doi.org/10.13039/501100007446)
Identifiers: 9922831008331
Academic Unit: King Khalid University
Language: English
Resource Type: Journal article