Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach

Journal article

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Reza Reihanisaransari, Farshad Samadifam, Anas A. Salameh, Farzam Mohammadiazar, Nafiseh Amiri and Sittiporn Channumsin

IEEE access, Vol.10, pp.123757-123768

2022

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Title: Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach
Creators - without role: Reza Reihanisaransari - University of Houston
Farshad Samadifam - Medical College of Wisconsin
Anas A. Salameh - Prince Sattam Bin Abdulaziz University
Farzam Mohammadiazar - University of Tabriz
Nafiseh Amiri - University of Houston
Sittiporn Channumsin - National Science and Technology Development Agency
Publication Details: IEEE access, Vol.10, pp.123757-123768
Identifiers: 9925878608331
Academic Unit: Prince Sattam Bin Abdulaziz University
Language: English
Resource Type: Journal article