Abstract
Resistive switching (RS) devices are metal/insulator/metal cells that can change their electrical resistance when electrical stimuli are applied between the electrodes, and they can be used to store and compute data. Planar crossbar arrays of RS devices can offer a high integration density (>108 devices mm−2) and this can be further enhanced by stacking them three‐dimensionally. The advantage of using layered materials (LMs) in RS devices compared to traditional phase‐change materials and metal oxides is that their electrical properties can be adjusted with a higher precision. Here, the key figures‐of‐merit and procedures to implement LM‐based RS devices are defined. LM‐based RS devices fabricated using methods compatible with industry are identified and discussed. The focus is on small devices (size < 9 µm2) arranged in crossbar structures, since larger devices may be affected by artifacts, such as grain boundaries and flake junctions. How to enhance device performance, so to accelerate the development of this technology, is also discussed.
Resistive switching devices made of layered materials (LMs) have shown interesting performance. However, most studies employ fabrication methods and device structures that are not industry‐relevant. In this review, the focus is on the status of crossbar arrays of LMs.