Abstract
The purpose of this review article is to summarize previous research works done on polymer composites filled with various types of nitride compounds for potential applications, specially for electronic and thermal management applications. It includes the general structure and introduction to nitride compounds, the assessment of nitride compounds filled polymer composites, and their relevant applications. The current industry's heat and electrical equipment requirements are lightweight, low cost, compactness, mechanical properties as well as superior thermal and electrical properties. The aluminum and copper-based materials show an excellent properties, but they are expensive and heavy. Hence, polymers are preferred in place of metals due to their recyclability, low cost, and sufficient mechanical, thermal, and electrical properties suitable for various applications. Further addition of nitride compounds such as boron nitride (BN), silicon nitride (Si3N4), carbon nitride (C3N4), aluminum nitride (AlN), and titanium nitride (TiN) to these polymers boost the overall mechanical, thermal, and electrical properties of the resultant composites. These conductive nitride compounds addition gives a major contribution to the thermal conductivity and dielectric properties enhancement in the polymer composites. In this review article, an attempt is made to summarize and explore brief results and key points of previous research works done on the nitride compounds loaded polymer composites. This review will be beneficial and motivate the current, upcoming researchers to conduct innovative works related to nitride compounds filled polymer composites to increase the applicability in various sectors. (C) 2022 The Author(s). Published by Elsevier B.V.