Abstract
Due to the miniaturization of electronic devices, electromigration became one of the serious reliability issues in lead-free solder joints. The orientation of the beta-Sn grain plays an important role in electromigration failures. Several studies have been carried out to investigate the effect of Sn grain orientation on electromigration. The efforts involve the influence of beta-Sn grain orientation on the migration of Cu, Sn, and Ni atoms, on the morphology of the solder joint, and on the formation of Cu6Sn5 and (Cu, Ni)6Sn6 in the lead-free solder joint during electromigration. The current review provides a detailed review of past studies which were conducted to investigate the influence of beta-Sn grain orientation on electromigration failures in lead-free solder joints.