Simulation of drop/impact reliability for electronic devices

Journal article

Peer reviewed

Y. Y Wang, C LU, J LI, X. M Tan and Y. C Tse

Finite elements in analysis and design, Vol.41(6), pp.667-680

01/03/2005

Abstract

Applied sciences

Exact sciences and technology

Fracture mechanics (crack, fatigue, damage...)

Fundamental areas of phenomenology (including applications)

Material handling, hoisting. Storage. Packaging

Packaging

Physics

Solid mechanics

Structural and continuum mechanics

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Title: Simulation of drop/impact reliability for electronic devices
Creators - without role: Y. Y Wang - Institute of High Performance Computing
C LU - Institute of High Performance Computing
J LI - Institute of High Performance Computing
X. M Tan - Institute of High Performance Computing
Y. C Tse - Institute of High Performance Computing
Publication Details: Finite elements in analysis and design, Vol.41(6), pp.667-680
Publisher: Elsevier
Identifiers: 9945781908331
Academic Unit: King Abdullah University of Science & Technology
Language: English
Resource Type: Journal article