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Solidification Shrinkage Defects in Electronic Solders
Journal article   Peer reviewed

Solidification Shrinkage Defects in Electronic Solders

Girish Wable, Srinivas Chada, Bryan Neal and Raymond Fournelle
JOM (1989), Vol.57(6), pp.38-42
01/06/2005

Abstract

Alloy solidification Alloys Defects Effects Heat Lead content Lead free solders Materials science Reliability engineering Shrinkage Solidification Studies Topography
Alloys containing a higher percentage of tin and/or alloys that undergo dendritic solidification over a broad range of temperature are prone to exhibit a disparity in contraction behavior of the solid and liquid phases. This disparity can lead to several features in solder joints such as surface roughness, shrinkage voids, fillet lifting, and hot tearing. In non-eutectic solders, primary phases nucleate and grow first during solidification.

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