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Stick-slip substructure in rapid tape peeling
Journal article

Stick-slip substructure in rapid tape peeling

S. T. Thoroddsen, H. D. Nguyen, K. Takehara and T. G. Etoh
Physical review. E, Statistical, nonlinear, and soft matter physics, Vol.82(4), pp.046107-046107
10/2010
PMID: 21230345

Abstract

Physical Sciences Physics Physics, Fluids & Plasmas Physics, Mathematical Science & Technology

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