Surface dispersion engineering of Ag-Au alloy films

Zhejun Liu; Dengxin Ji; Xie Zeng; Haomin Song; Jiyan Liu; Suhua Jiang; Qiaoqiang Gan

doi:10.7567/APEX.8.042601

Back

Surface dispersion engineering of Ag-Au alloy films

Journal article

Peer reviewed

Surface dispersion engineering of Ag-Au alloy films

Zhejun Liu, Dengxin Ji, Xie Zeng, Haomin Song, Jiyan Liu, Suhua Jiang and Qiaoqiang Gan

Applied physics express, Vol.8(4), p.42601

01/04/2015

DOI: https://doi.org/10.7567/APEX.8.042601

Abstract

By controlling the content ratio of Ag and Au during the metal co-sputtering process, we demonstrate that the surface dispersion properties of alloy metal films can be manipulated with no need to tune the geometric parameters for surface patterns. This inexpensive technology provides a different way to engineer the surface dispersion properties of plasmonic metamaterial components on a chip.

Metrics

1 Record Views

Details

Title: Surface dispersion engineering of Ag-Au alloy films
Creators - without role: Zhejun Liu - Fudan University
Dengxin Ji - The State University of New York Department of Electrical Engineering, University at Buffalo, Buffalo, NY 14260, U.S.A
Xie Zeng - The State University of New York Department of Electrical Engineering, University at Buffalo, Buffalo, NY 14260, U.S.A
Haomin Song - The State University of New York Department of Electrical Engineering, University at Buffalo, Buffalo, NY 14260, U.S.A
Jiyan Liu - Jianghan University
Suhua Jiang - Fudan University
Qiaoqiang Gan - The State University of New York Department of Electrical Engineering, University at Buffalo, Buffalo, NY 14260, U.S.A
Publication Details: Applied physics express, Vol.8(4), p.42601
Publisher: The Japan Society of Applied Physics
Number of pages: 3
Identifiers: 9945558808331
Academic Unit: King Abdullah University of Science & Technology
Language: English
Resource Type: Journal article