Temperature Distributions in a Stress-Relief-Type Plate of Functionally Graded Material under Thermal Shock

Journal article

Open access

Peer reviewed

Hideo Awaji, Hiromitsu Takenaka, Sawao Honda and Tadahiro Nishikawa

Nihon Seramikkusu Kyōkai gakujutsu ronbunshi, Vol.107(1249), pp.780-785

01/09/1999

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Title: Temperature Distributions in a Stress-Relief-Type Plate of Functionally Graded Material under Thermal Shock
Creators - without role: Hideo Awaji - Nagoya Institute of Technology
Hiromitsu Takenaka - Nagoya Institute of Technology
Sawao Honda - Nagoya Institute of Technology
Tadahiro Nishikawa - Nagoya Institute of Technology
Publication Details: Nihon Seramikkusu Kyōkai gakujutsu ronbunshi, Vol.107(1249), pp.780-785
Identifiers: 9933452808331
Academic Unit: University of Jeddah
Language: English
Resource Type: Journal article