The 2021 flexible and printed electronics roadmap

Yvan Bonnassieux; Christoph J. Brabec; Yong Cao; Tricia Breen Carmichael; Michael L. Chabinyc; Kwang-Ting Cheng; Gyoujin Cho; Anjung Chung; Corie L. Cobb; Andreas Distler; Hans-Joachim Egelhaaf; Gerd Grau; Xiaojun Guo; Ghazaleh Haghiashtiani; Tsung-Ching Huang; Muhammad M. Hussain; Benjamin Iniguez; Taik-Min Lee; Ling Li; Yuguang Ma; Dongge Ma; Michael C. McAlpine; Tse Nga Ng; Ronald osterbacka; Shrayesh N. Patel; Junbiao Peng; Huisheng Peng; Jonathan Rivnay; Leilai Shao; Daniel Steingart; Robert A. Street; Vivek Subramanian; Luisa Torsi; Yunyun Wu

doi:10.1088/2058-8585/abf986

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The 2021 flexible and printed electronics roadmap

Journal article

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Peer reviewed

The 2021 flexible and printed electronics roadmap

Yvan Bonnassieux, Christoph J. Brabec, Yong Cao, Tricia Breen Carmichael, Michael L. Chabinyc, Kwang-Ting Cheng, Gyoujin Cho, Anjung Chung, Corie L. Cobb, Andreas Distler, …

Flexible and printed electronics, Vol.6(2), p.23001

01/06/2021

DOI: https://doi.org/10.1088/2058-8585/abf986

Abstract

Materials Science

Materials Science, Multidisciplinary

Science & Technology

Technology

This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1-9), fabrication techniques (sections 10-12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.

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Title: The 2021 flexible and printed electronics roadmap
Creators - without role: Yvan Bonnassieux - Institut Polytechnique de Paris
Christoph J. Brabec - Friedrich-Alexander-Universität Erlangen-Nürnberg
Yong Cao - South China Univ Technol, 381 Wushan Rd, Guangzhou 510641, Guangdong, Peoples R China
Tricia Breen Carmichael - University of Windsor
Michael L. Chabinyc - Univ Calif Santa Barbara, Dept Mat, Santa Barbara, CA 93016 USA
Kwang-Ting Cheng - University of Hong Kong
Gyoujin Cho - Sungkyunkwan University
Anjung Chung - Sungkyunkwan University
Corie L. Cobb - University of Washington
Andreas Distler - Bavarian Ctr Appl Energy Res eV, Dept Renewable Energies, Solar Factory Future, Further Str 250, D-90429 Nurnberg, Germany
Hans-Joachim Egelhaaf - Friedrich-Alexander-Universität Erlangen-Nürnberg
Gerd Grau - York Univ, Dept Elect Engn & Comp Sci, Toronto, ON, Canada
Xiaojun Guo - Shanghai Jiao Tong University
Ghazaleh Haghiashtiani - University of Minnesota
Tsung-Ching Huang - Hewlett Packard Lab, 820 N McCarthy Blvd, Milpitas, CA 95035 USA
Muhammad M. Hussain - King Abdullah Univ Sci & Technol, Elect & Comp Engn, Thuwal 239556900, Saudi Arabia
Benjamin Iniguez - Univ Rovira & Virgili, Tarragona, Spain
Taik-Min Lee - Korea Inst Machinery & Mat KIMM, Dept Printed Elect, 156 Gajeongbuk Ro, Daejeon 34103, South Korea
Ling Li - Chinese Acad Sci, Inst Microelect, Beitucheng West Rd, Beijing 100029, Peoples R China
Yuguang Ma - South China Univ Technol, 381 Wushan Rd, Guangzhou 510641, Guangdong, Peoples R China
Dongge Ma - South China Univ Technol, 381 Wushan Rd, Guangzhou 510641, Guangdong, Peoples R China
Michael C. McAlpine - University of Minnesota
Tse Nga Ng - AKAD University
Ronald osterbacka - University of Chicago
Shrayesh N. Patel - Fudan University
Junbiao Peng - South China Univ Technol, 381 Wushan Rd, Guangzhou 510641, Guangdong, Peoples R China
Huisheng Peng - Northwestern University
Jonathan Rivnay - Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
Leilai Shao - Columbia University
Daniel Steingart - Columbia University
Robert A. Street - Ecole Polytech Fed Lausanne, Inst Microengn, Lausanne, Switzerland
Vivek Subramanian - Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
Luisa Torsi - University of Bari Aldo Moro
Yunyun Wu - University of Windsor
Publication Details: Flexible and printed electronics, Vol.6(2), p.23001
Publisher: IOP Publishing Ltd
Number of pages: 48
Grant note: HKUST 16203319 / Research Grants Council (RGC), Hong Kong; Hong Kong Research Grants Council FA8650-15-2-5401 / Air Force Research Laboratory
Identifiers: 9944950708331
Academic Unit: King Saud University
Language: English
Resource Type: Journal article