Abstract
We present modeling, simulation, and characterization for the dynamic response of clamped–clamped microbeams under mechanical shock. A Galerkin-based reduced-order model is utilized and its results are verified by comparing to finite-element results. The results indicate that the response of a microbeam to mechanical shock is inherently non-linear because of the dominating effect of mid-plane stretching. The effect of the shock pulse shape is investigated. It is concluded that the shape of the shock pulse can result in significant dynamic amplification in the response of the microbeam even in cases where the shock load is considered quasi-static.
The combined effect of the electrostatic force and mechanical shock is investigated. The results show that this combined effect can lead to early instability in microelectromechanical systems (MEMS) devices through dynamic pull-in. This could explain some of the reported experimental evidences for the existence of strange modes of failure of MEMS devices under mechanical shock and impact. These failures are characterized by overlaps between moving microstructures and stationary electrodes, which cause electrical shorts. The shock-electrostatic interaction is shown to be promising to design smart MEMS switches triggered at predetermined level of shock and acceleration. Finally, the mechanical shock combined with the packaging effect of MEMS devices is analyzed. A single-degree-of-freedom model representing the motion of the package, which is mounted over a printed circuit board, coupled with the continuous beam model is utilized. Our results reveal that neglecting the effect of the package motion on the response of microbeams can overestimate or underestimate their response. It is concluded that a poor design of the package may result in severe amplification of the shock effect leading to a device failure.