Abstract
•Transparent thin-film transistors (TFTs) were fabricated, characterized and modeled.•The thermal annealing of fabricated devices has enhanced their performances.•Thin-film transistors having the lowest Zn content showed the high performance.•The combined of annealing and low Zn content in the active layer result TFTs high performance.•The analytical model results are in close agreement with the experimental data.
In this study, we present a quantitative analysis of the electrical properties of a series of bottom- gate top-contact n-channel transparent thin film transistors (TFTs) based on zinc indium tin oxide (Zn-In-SnO) ternary compound with various ZnO content. In addition, the effect of annealing on the TFTs electrical properties was examined theoretically and experimentally. The obtained results revealed that the thermal annealing of fabricated devices in air atmosphere at 300 °C has enhanced their performances; this behavior is well observed for all devices fabricated with different composition of Zn-In-SnO. TFTs having the lowest Zn content of 17.1% and annealed 300°C showed the high electrical performances in term of drain current, saturation mobility, threshold voltage. For the total resistance modeling of the fabricated devices with various content of ZnO and that annealed 300 °C, grain boundary model based on Meyer–Neldel rule was applied. The obtained results revealed that the total resistance was increased with increasing ZnO content. Furthermore, an analytical model has been refined in order to reproduce the current-voltage relationships of the fabricated TFTs using the overall resistance obtained from the NMR–GBT model. The calculated results are in good agreement with the experimental measurements of all fabricated devices. The obtained performance of TFTs based on zinc indium tin oxide with low content of ZnO and annealed will be promising for application in the future backplane of flat panel displays.