Sign in
Thermal management of electronic devices using carbon foam and PCM/nano-composite
Journal article   Peer reviewed

Thermal management of electronic devices using carbon foam and PCM/nano-composite

W. G. Alshaer, S. A. Nada, M. A. Rady, Elena Palomo Del Barrio and Alain Sommier
International journal of thermal sciences, Vol.89, pp.79-86
01/03/2015

Abstract

Engineering Engineering, Mechanical Physical Sciences Science & Technology Technology Thermodynamics

Metrics

1 Record Views

Details