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Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature–entropy analysis
Journal article   Peer reviewed

Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature–entropy analysis

A. Chakraborty, B.B. Saha, S. Koyama and K.C. Ng
International journal of heat and mass transfer, Vol.49(19), pp.3547-3554
01/09/2006

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