Sign in
Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method
Journal article   Peer reviewed

Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method

Ping Li, Yilin Dong, Min Tang, Junfa Mao, Li Jun Jiang and Hakan Bagci
IEEE transactions on components, packaging, and manufacturing technology (2011), Vol.7(6), pp.862-871
01/06/2017

Abstract

Auxiliary-differential equation (ADE) method discontinuous Galerkin time-domain (DGTD) method Finite element analysis Heating systems Integrated circuit modeling integrated circuit package Mathematical model numerical flux Thermal analysis Transient analysis transient thermal analysis

Metrics

1 Record Views

Details