Abstract
Unprecedented 800% stretchable, non‐polymeric, widely used, low‐cost, naturally rigid, metallic thin‐film copper (Cu)‐based flexible and non‐invasive, spatially tunable, mobile thermal patch with wireless controllability, adaptability (tunes the amount of heat based on the temperature of the swollen portion), reusability, and affordability due to low‐cost complementary metal oxide semiconductor (CMOS) compatible integration.