Understanding the impact of inductance in carbon nanotube bundles for VLSI interconnect using scalable modeling techniques

Journal article

Peer reviewed

Arthur Nieuwoudt and Yehia Massoud

IEEE transactions on nanotechnology, Vol.5(6), pp.758-765

01/11/2006

Abstract

Applied sciences

Design. Technologies. Operation analysis. Testing

Electronics

Exact sciences and technology

Integrated circuits

Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices

1 Record Views

Title: Understanding the impact of inductance in carbon nanotube bundles for VLSI interconnect using scalable modeling techniques
Creators - without role: Arthur Nieuwoudt - Rice University
Yehia Massoud - Rice University
Publication Details: IEEE transactions on nanotechnology, Vol.5(6), pp.758-765
Publisher: Institute of Electrical and Electronics Engineers
Identifiers: 9944535908331
Academic Unit: King Abdullah University of Science & Technology
Language: English
Resource Type: Journal article