Abstract
An aluminum based alloy, Al–Cu–Mg–Ti, was prepared via Osprey forming and extrusion. An elongated substructure toward the extrusion direction was observed after extrusion. Annealing treatments at temperatures up to 450 °C do not have an effect on such microstructure. Emergence of (sub)grains was observed at the highest annealing temperature of 520 °C which is associated to the misorientation increase of the (sub)boundaries. Tensile tests at different temperatures and also temperature-change tests were performed at strain rates of 10− 4, 10− 3 and 10− 2 s− 1. The analysis of data showed that the stress exponent coefficient increases from 5 at 500 °C to close to 14 at about 250 °C. The activation energy for deformation in both regimes was higher than that corresponding to aluminum self-diffusion. This creep behavior was associated with that of dispersion strengthened aluminum alloys.
M. Eddahbi thanks the Grant 345/2000 from the Comunidad
Autónoma de Madrid.
The authors gratefully acknowledge the support of the
Comisión Interministerial de Ciencia y Tecnología(CICYT)
under Grant MAT2003-1172.
Peer reviewed